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SEMICONDUCTOR-X

Dataspace development towards resilient semiconductor supply and value chains for Europe

Credit: Intel Corporation

Semiconductor-X is a Manufacturing-X project with focus on the semiconductor industry

Semiconductor-X aims to adapt the Gaia-X/Catena-X dataspace architecture for the semiconductor industry, developing advanced digital twin technologies to digitally represent critical planning segments of the semiconductor supply and value chain. The project will also look after integrating established industry standards into this new dataspace architecture.

> More information about Manufacturing-X

Motivation

  • To enable efficient, sustainable, and resilient operations in the semiconductor industry through industry-wide digitization and dataspaces for improved traceability in the value chain.
  • To enhance deep-digitization capabilities, among value chain partners and particularly among SMEs (Small and Middle sized Enterprises).
  • To enable new data-driven business models and strengthen innovations.
  • To enable deep-interoperability and AI-applications by digitizing every asset and entity related to the semiconductor value chain.
  • To ensure the availability of semiconductors for European key technologies and industries.

 

Horizontal. Vertical. Continuous. Industry-specific application clusters

Cluster 1

Resilient value chain for a heterogeneous integration ecosystems

Heterogeneous integration
Credit: Intel Corporation

Building competitive and resilient value chains through the comprehensive heterogeneous integration of partners involved in the packaging technology. Complex Inbound Supply Chain of the Semiconductor Industry – Over 1,000 Processing Steps and More Than 70 Border Crossings.

Cluster 2

Resilient Network Nodes – Digital Integration for Optimized Factory Operations

wafer production measuring
Credit: Intel Corporation

Developing concepts, semantic data models, and services for inter-company data exchange within network nodes and the Integration of data and services for factory & supply chain assets within the dataspace.

Cluster 3

Sustainability

Sustainability in chip design. Man holding a chip.
Credit: Intel Corporation

Developing the methodology for the LCA (Life Cycle Assessment) for storing the LCA datasets in semantic submodels of the Digital Twin. Optimizations in the Digital Twin through methods of machine learning and statistical mathematics.

Project Partners

Associated Partners