#Demonstrator: PCF Determination for a SIP-Modul (Chiplets) as sample device in Mini-Supply Chain 🚀
Our Application Cluster 3 Team #Sustainability in the Semiconductor-X project is turning ecological sustainability in the #semiconductor industry into something ➡️ measurable, ➡️ comparable and ➡️ actionable.
To demonstrate this in practice, a representative mini supply chain is being set up among project partners, using an exemplary System-in-Package (SiP) flow for heterogeneous integration.
👉 We’re excited to share ongoing activities from the SEMICONDUCTOR-X project, demonstrating how the Catena-X “One-Up-One-Down” Product Carbon Footprint (PCF) exchange mechanism can be put into practice for supply chain carbon accounting.
To bring this to life, we’ve set up a representative mini supply chain among project partners that reflects key stages of semiconductor manufacturing. In this use case, we focus on heterogeneous integration within an exemplary System-in-Package (SiP) production flow and showcase how PCF data can be exchanged between the involved actors.
This work demonstrates how standardized #PCF data sharing can significantly improve transparency, interoperability, and scalability of carbon accounting across complex semiconductor value chains. Owners: Franz Wenninger and Fraunhofer EMFT team
Stay tuned for more insights as we continue to drive practical Catena-X implementations in the electronics sector. We give a first #DEMO and showcase at our booth HANNOVER MESSE 2026 (April 20–24) at Hall 13 C24, the world’s leading industrial tech fair.